Mathematical and physical modeling of flip-chip soldering processes

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1995.

Bibliographic Details
Main Author:	Deering, Scott E. (Scott Earl), 1967-
Other Authors:	Julian Szekely.
Format:	Thesis
Language:	eng
Published:	Massachusetts Institute of Technology 2005
Subjects:	Materials Science and Engineering
Online Access:	http://hdl.handle.net/1721.1/11115

Internet

http://hdl.handle.net/1721.1/11115