Mathematical and physical modeling of flip-chip soldering processes
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1995.
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Format: | Thesis |
Language: | eng |
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Massachusetts Institute of Technology
2005
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Online Access: | http://hdl.handle.net/1721.1/11115 |
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author | Deering, Scott E. (Scott Earl), 1967- |
author2 | Julian Szekely. |
author_facet | Julian Szekely. Deering, Scott E. (Scott Earl), 1967- |
author_sort | Deering, Scott E. (Scott Earl), 1967- |
collection | MIT |
description | Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1995. |
first_indexed | 2024-09-23T10:23:28Z |
format | Thesis |
id | mit-1721.1/11115 |
institution | Massachusetts Institute of Technology |
language | eng |
last_indexed | 2024-09-23T10:23:28Z |
publishDate | 2005 |
publisher | Massachusetts Institute of Technology |
record_format | dspace |
spelling | mit-1721.1/111152019-04-12T09:36:21Z Mathematical and physical modeling of flip-chip soldering processes Deering, Scott E. (Scott Earl), 1967- Julian Szekely. Massachusetts Institute of Technology. Dept. of Materials Science and Engineering Materials Science and Engineering Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1995. Includes bibliographical references (p. 312-314). by Scott E. Deering. Ph.D. 2005-08-17T23:30:34Z 2005-08-17T23:30:34Z 1995 1995 Thesis http://hdl.handle.net/1721.1/11115 34148884 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 332 p. 20053370 bytes 20053126 bytes application/pdf application/pdf application/pdf Massachusetts Institute of Technology |
spellingShingle | Materials Science and Engineering Deering, Scott E. (Scott Earl), 1967- Mathematical and physical modeling of flip-chip soldering processes |
title | Mathematical and physical modeling of flip-chip soldering processes |
title_full | Mathematical and physical modeling of flip-chip soldering processes |
title_fullStr | Mathematical and physical modeling of flip-chip soldering processes |
title_full_unstemmed | Mathematical and physical modeling of flip-chip soldering processes |
title_short | Mathematical and physical modeling of flip-chip soldering processes |
title_sort | mathematical and physical modeling of flip chip soldering processes |
topic | Materials Science and Engineering |
url | http://hdl.handle.net/1721.1/11115 |
work_keys_str_mv | AT deeringscottescottearl1967 mathematicalandphysicalmodelingofflipchipsolderingprocesses |