Mathematical and physical modeling of flip-chip soldering processes

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1995.

Bibliographic Details
Main Author: Deering, Scott E. (Scott Earl), 1967-
Other Authors: Julian Szekely.
Format: Thesis
Language:eng
Published: Massachusetts Institute of Technology 2005
Subjects:
Online Access:http://hdl.handle.net/1721.1/11115
_version_ 1811076519717502976
author Deering, Scott E. (Scott Earl), 1967-
author2 Julian Szekely.
author_facet Julian Szekely.
Deering, Scott E. (Scott Earl), 1967-
author_sort Deering, Scott E. (Scott Earl), 1967-
collection MIT
description Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1995.
first_indexed 2024-09-23T10:23:28Z
format Thesis
id mit-1721.1/11115
institution Massachusetts Institute of Technology
language eng
last_indexed 2024-09-23T10:23:28Z
publishDate 2005
publisher Massachusetts Institute of Technology
record_format dspace
spelling mit-1721.1/111152019-04-12T09:36:21Z Mathematical and physical modeling of flip-chip soldering processes Deering, Scott E. (Scott Earl), 1967- Julian Szekely. Massachusetts Institute of Technology. Dept. of Materials Science and Engineering Materials Science and Engineering Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1995. Includes bibliographical references (p. 312-314). by Scott E. Deering. Ph.D. 2005-08-17T23:30:34Z 2005-08-17T23:30:34Z 1995 1995 Thesis http://hdl.handle.net/1721.1/11115 34148884 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 332 p. 20053370 bytes 20053126 bytes application/pdf application/pdf application/pdf Massachusetts Institute of Technology
spellingShingle Materials Science and Engineering
Deering, Scott E. (Scott Earl), 1967-
Mathematical and physical modeling of flip-chip soldering processes
title Mathematical and physical modeling of flip-chip soldering processes
title_full Mathematical and physical modeling of flip-chip soldering processes
title_fullStr Mathematical and physical modeling of flip-chip soldering processes
title_full_unstemmed Mathematical and physical modeling of flip-chip soldering processes
title_short Mathematical and physical modeling of flip-chip soldering processes
title_sort mathematical and physical modeling of flip chip soldering processes
topic Materials Science and Engineering
url http://hdl.handle.net/1721.1/11115
work_keys_str_mv AT deeringscottescottearl1967 mathematicalandphysicalmodelingofflipchipsolderingprocesses