Mathematical and physical modeling of flip-chip soldering processes

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1995.

Detalles Bibliográficos
Autor principal:	Deering, Scott E. (Scott Earl), 1967-
Otros Autores:	Julian Szekely.
Formato:	Tesis
Lenguaje:	eng
Publicado:	Massachusetts Institute of Technology 2005
Materias:	Materials Science and Engineering
Acceso en línea:	http://hdl.handle.net/1721.1/11115

Internet

http://hdl.handle.net/1721.1/11115