Near junction thermal management of GaN HEMTs via wafer bonding

Thesis: M. Eng., Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 2017.

Bibliographic Details
Main Author:	Radway, Robert M
Other Authors:	Tomás Palacios.
Format:	Thesis
Language:	eng
Published:	Massachusetts Institute of Technology 2018
Subjects:	Electrical Engineering and Computer Science.
Online Access:	http://hdl.handle.net/1721.1/113116

Internet

http://hdl.handle.net/1721.1/113116