Electromigration failure and reliability of single-crystal and polycyrstalline aluminum interconnects for integrated circuits

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1995.

Bibliographic Details
Main Author:	Joo, Young-Chang
Other Authors:	Carl V. Thompson.
Format:	Thesis
Language:	eng
Published:	Massachusetts Institute of Technology 2005
Subjects:	Materials Science and Engineering
Online Access:	http://hdl.handle.net/1721.1/11446

Internet

http://hdl.handle.net/1721.1/11446