Thin Film Evaporation Using Nanoporous Membranes for Enhanced Heat Transfer
Recent advancements in integrated circuits demand the development of novel thermal management schemes that can dissipate ultra-high heat fluxes with high heat transfer coefficients. Previous study demonstrated the potential of thin film evaporation on micro/nanostructured surfaces. Theoretical calcu...
| Main Authors: | , , |
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| Format: | Article |
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ASME International
2019
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| Online Access: | http://hdl.handle.net/1721.1/120351 https://orcid.org/0000-0001-7045-1200 |