Multi-strata subsurface laser die singulation to enable defect-free ultra-thin stacked memory dies
We report the extension of multi-strata subsurface infrared (1.342 μm) pulsed laser die singulation to the fabrication of defect-free ultra-thin stacked memory dies. We exploit the multi-strata interactions between generated thermal shockwaves and the preceding high dislocation density layers formed...
| Main Authors: | , , |
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| Format: | Article |
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AIP Publishing
2019
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| Online Access: | http://hdl.handle.net/1721.1/120759 https://orcid.org/0000-0002-0417-445X https://orcid.org/0000-0002-9038-1622 |