Managing process development risk : aluminum ultrasonic wire bonding for chip-on-board applications

Managing process development risk : aluminum ultrasonic wire bonding for chip-on-board applications

Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management, 1993, and Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1993.

Detalhes bibliográficos
Autor principal: Smith, Gregory J. (Gregory John)
Outros Autores: Lionel C. Kimerling and Steven D. Eppinger.
Formato: Tese
Idioma:eng
Publicado em: Massachusetts Institute of Technology 2005
Assuntos:
Sloan School of Management
Electrical Engineering and Computer Science
Acesso em linha:http://hdl.handle.net/1721.1/12393

Internet

http://hdl.handle.net/1721.1/12393

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