Silicon pressure sensor using wafer bonding technology

Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1993.

Bibliographic Details
Main Author:	Parameswaran, Lalitha
Other Authors:	Martin A. Schmidt.
Format:	Thesis
Language:	eng
Published:	Massachusetts Institute of Technology 2005
Subjects:	Electrical Engineering and Computer Science
Online Access:	http://hdl.handle.net/1721.1/12471

Internet

http://hdl.handle.net/1721.1/12471