Powder filling and sintering of 3D in-chip solenoid coils with high aspect ratio structure
In this study, a 3D coil embedded in a silicon substrate including densely distributed through-silicon vias (TSVs) was fabricated via a rapid metal powder sintering process. The filling and sintering methods for microdevices were evaluated, and the effects of powder types were compared. The paramete...
| Main Authors: | , , , , , |
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| Other Authors: | |
| Format: | Article |
| Published: |
Multidisciplinary Digital Publishing Institute
2020
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| Online Access: | https://hdl.handle.net/1721.1/125077 |