Gate current degradation in W-band InAlN/AlN/GaN HEMTs under gate stress

Schottky gate degradation of W-band InAlN/AlN/GaN high-electron-mobility transistors (HEMTs) has been studied under prolonged positive gate stress. Two different degradation mechanisms have been identified. In an early stage, a gate leakage current increase takes place without any observable drain c...

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Main Authors: Wu, Yufei, del Alamo, Jesus A
Other Authors: Massachusetts Institute of Technology. Microsystems Technology Laboratories
Format: Article
Published: Institute of Electrical and Electronics Engineers (IEEE) 2020
Online Access:https://hdl.handle.net/1721.1/126176
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author Wu, Yufei
del Alamo, Jesus A
author2 Massachusetts Institute of Technology. Microsystems Technology Laboratories
author_facet Massachusetts Institute of Technology. Microsystems Technology Laboratories
Wu, Yufei
del Alamo, Jesus A
author_sort Wu, Yufei
collection MIT
description Schottky gate degradation of W-band InAlN/AlN/GaN high-electron-mobility transistors (HEMTs) has been studied under prolonged positive gate stress. Two different degradation mechanisms have been identified. In an early stage, a gate leakage current increase takes place without any observable drain current nor source and drain resistance degradation. We propose electric field induced trap generation in the AlN barrier layer as the cause. Under harsher gate stress, a second degradation mechanism kicks in where gate leakage current, as well as drain current and the source and drain resistances degrade significantly. We attribute this to Schottky barrier degradation due to severe local self-heating.
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spelling mit-1721.1/1261762022-10-01T09:10:47Z Gate current degradation in W-band InAlN/AlN/GaN HEMTs under gate stress Wu, Yufei del Alamo, Jesus A Massachusetts Institute of Technology. Microsystems Technology Laboratories Schottky gate degradation of W-band InAlN/AlN/GaN high-electron-mobility transistors (HEMTs) has been studied under prolonged positive gate stress. Two different degradation mechanisms have been identified. In an early stage, a gate leakage current increase takes place without any observable drain current nor source and drain resistance degradation. We propose electric field induced trap generation in the AlN barrier layer as the cause. Under harsher gate stress, a second degradation mechanism kicks in where gate leakage current, as well as drain current and the source and drain resistances degrade significantly. We attribute this to Schottky barrier degradation due to severe local self-heating. National Reconnaissance Office (Contract DII NRO000-13C0309) 2020-07-14T15:21:15Z 2020-07-14T15:21:15Z 2017-06 2017-04 Article http://purl.org/eprint/type/ConferencePaper 9781509066414 1938-1891 https://hdl.handle.net/1721.1/126176 Wu, Yufei and Jesus A. del Alamo. "Gate current degradation in W-band InAlN/AlN/GaN HEMTs under gate stress." IEEE International Reliability Physics Symposium Proceedings, April 2017, Monterey, CA, USA, Institute of Electrical and Electronics Engineers, June 2017 © 2017 IEEE http://dx.doi.org/10.1109/irps.2017.7936284 IEEE International Reliability Physics Symposium Proceedings Creative Commons Attribution-Noncommercial-Share Alike http://creativecommons.org/licenses/by-nc-sa/4.0/ application/msword application/pdf Institute of Electrical and Electronics Engineers (IEEE) Prof. del Alamo via Phoebe Ayers
spellingShingle Wu, Yufei
del Alamo, Jesus A
Gate current degradation in W-band InAlN/AlN/GaN HEMTs under gate stress
title Gate current degradation in W-band InAlN/AlN/GaN HEMTs under gate stress
title_full Gate current degradation in W-band InAlN/AlN/GaN HEMTs under gate stress
title_fullStr Gate current degradation in W-band InAlN/AlN/GaN HEMTs under gate stress
title_full_unstemmed Gate current degradation in W-band InAlN/AlN/GaN HEMTs under gate stress
title_short Gate current degradation in W-band InAlN/AlN/GaN HEMTs under gate stress
title_sort gate current degradation in w band inaln aln gan hemts under gate stress
url https://hdl.handle.net/1721.1/126176
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