Anomalous Source-Side Degradation of InAlN/GaN HEMTs Under High-Power Electrical Stress

The electrical degradation of InAlN/GaN high-electron-mobility transistors for millimeter-wave applications has been examined under simultaneous high V [subscript DS,stress] and high I[subscript Dstress] electrical stress. Besides a drain current decrease and a positive threshold voltage shift, the...

Full description

Bibliographic Details
Main Authors: Wu, Yufei, Sasangka, Wardhana A., del Alamo, Jesus A
Other Authors: Massachusetts Institute of Technology. Microsystems Technology Laboratories
Format: Article
Published: Institute of Electrical and Electronics Engineers (IEEE) 2020
Online Access:https://hdl.handle.net/1721.1/126185
_version_ 1811095032971657216
author Wu, Yufei
Sasangka, Wardhana A.
del Alamo, Jesus A
author2 Massachusetts Institute of Technology. Microsystems Technology Laboratories
author_facet Massachusetts Institute of Technology. Microsystems Technology Laboratories
Wu, Yufei
Sasangka, Wardhana A.
del Alamo, Jesus A
author_sort Wu, Yufei
collection MIT
description The electrical degradation of InAlN/GaN high-electron-mobility transistors for millimeter-wave applications has been examined under simultaneous high V [subscript DS,stress] and high I[subscript Dstress] electrical stress. Besides a drain current decrease and a positive threshold voltage shift, the creation of an anomalous source-side gate leakage path has been identified. We attribute this to high electric-field induced trap generation in the AlN layer directly under the gate edge on the source side. The resulting increase in gate leakage further exacerbates the degradation of the gate diode. In addition, we postulate that high-power stress leads to significant device self-heating that causes gate sinking and leads to a permanent positive threshold voltage shift and drain current degradation.
first_indexed 2024-09-23T16:09:26Z
format Article
id mit-1721.1/126185
institution Massachusetts Institute of Technology
last_indexed 2024-09-23T16:09:26Z
publishDate 2020
publisher Institute of Electrical and Electronics Engineers (IEEE)
record_format dspace
spelling mit-1721.1/1261852022-10-02T06:45:21Z Anomalous Source-Side Degradation of InAlN/GaN HEMTs Under High-Power Electrical Stress Wu, Yufei Sasangka, Wardhana A. del Alamo, Jesus A Massachusetts Institute of Technology. Microsystems Technology Laboratories Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science Singapore-MIT Alliance in Research and Technology (SMART) The electrical degradation of InAlN/GaN high-electron-mobility transistors for millimeter-wave applications has been examined under simultaneous high V [subscript DS,stress] and high I[subscript Dstress] electrical stress. Besides a drain current decrease and a positive threshold voltage shift, the creation of an anomalous source-side gate leakage path has been identified. We attribute this to high electric-field induced trap generation in the AlN layer directly under the gate edge on the source side. The resulting increase in gate leakage further exacerbates the degradation of the gate diode. In addition, we postulate that high-power stress leads to significant device self-heating that causes gate sinking and leads to a permanent positive threshold voltage shift and drain current degradation. 2020-07-14T19:37:15Z 2020-07-14T19:37:15Z 2017-10 Article http://purl.org/eprint/type/JournalArticle 0018-9383 1557-9646 https://hdl.handle.net/1721.1/126185 Wu, Yufei et al. "Anomalous Source-Side Degradation of InAlN/GaN HEMTs Under High-Power Electrical Stress." IEEE Transactions on Electron Devices 64, 11 (November 2017): 4435 - 4441 © 2017 IEEE http://dx.doi.org/10.1109/ted.2017.2754248 IEEE Transactions on Electron Devices Creative Commons Attribution-Noncommercial-Share Alike http://creativecommons.org/licenses/by-nc-sa/4.0/ application/vnd.openxmlformats-officedocument.wordprocessingml.document application/pdf Institute of Electrical and Electronics Engineers (IEEE) Prof. del Alamo via Phoebe Ayers
spellingShingle Wu, Yufei
Sasangka, Wardhana A.
del Alamo, Jesus A
Anomalous Source-Side Degradation of InAlN/GaN HEMTs Under High-Power Electrical Stress
title Anomalous Source-Side Degradation of InAlN/GaN HEMTs Under High-Power Electrical Stress
title_full Anomalous Source-Side Degradation of InAlN/GaN HEMTs Under High-Power Electrical Stress
title_fullStr Anomalous Source-Side Degradation of InAlN/GaN HEMTs Under High-Power Electrical Stress
title_full_unstemmed Anomalous Source-Side Degradation of InAlN/GaN HEMTs Under High-Power Electrical Stress
title_short Anomalous Source-Side Degradation of InAlN/GaN HEMTs Under High-Power Electrical Stress
title_sort anomalous source side degradation of inaln gan hemts under high power electrical stress
url https://hdl.handle.net/1721.1/126185
work_keys_str_mv AT wuyufei anomaloussourcesidedegradationofinalnganhemtsunderhighpowerelectricalstress
AT sasangkawardhanaa anomaloussourcesidedegradationofinalnganhemtsunderhighpowerelectricalstress
AT delalamojesusa anomaloussourcesidedegradationofinalnganhemtsunderhighpowerelectricalstress