The Transition From Rebound to Bonding in High-Velocity Metallic Microparticle Impacts: Jetting-Associated Power-Law Divergence

Abstract: A metallic microparticle impacting a metallic substrate with sufficiently high velocity will adhere, assisted by the emergence of jetting—the splash-like extrusion of solid matter at the periphery of the impact. In this work, we compare real-time observations of high-velocity single-microp...

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Bibliographic Details
Main Authors: Sun, Yuchen, Veysset, David Georges, Nelson, Keith Adam, Schuh, Christopher A
Other Authors: Massachusetts Institute of Technology. Department of Chemistry
Format: Article
Language:English
Published: ASME International 2021
Online Access:https://hdl.handle.net/1721.1/129673