A liquid-shear-stress sensor using wafer-bonding technology

Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1990.

Bibliografische gegevens
Hoofdauteur:	Ng, Kay-Yip
Andere auteurs:	Martin A. Schmidt.
Formaat:	Thesis
Taal:	eng
Gepubliceerd in:	Massachusetts Institute of Technology 2005
Onderwerpen:	Electrical Engineering and Computer Science
Online toegang:	http://hdl.handle.net/1721.1/13434

Internet

http://hdl.handle.net/1721.1/13434