A liquid-shear-stress sensor using wafer-bonding technology
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1990.
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| Format: | Thesis |
| Language: | eng |
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Massachusetts Institute of Technology
2005
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| Online Access: | http://hdl.handle.net/1721.1/13434 |
| _version_ | 1811088020917452800 |
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| author | Ng, Kay-Yip |
| author2 | Martin A. Schmidt. |
| author_facet | Martin A. Schmidt. Ng, Kay-Yip |
| author_sort | Ng, Kay-Yip |
| collection | MIT |
| description | Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1990. |
| first_indexed | 2024-09-23T13:54:57Z |
| format | Thesis |
| id | mit-1721.1/13434 |
| institution | Massachusetts Institute of Technology |
| language | eng |
| last_indexed | 2024-09-23T13:54:57Z |
| publishDate | 2005 |
| publisher | Massachusetts Institute of Technology |
| record_format | dspace |
| spelling | mit-1721.1/134342019-04-12T12:10:32Z A liquid-shear-stress sensor using wafer-bonding technology Ng, Kay-Yip Martin A. Schmidt. Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science Electrical Engineering and Computer Science Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1990. Includes bibliographical references (leaves 131-135). by Kay-Yip Ng. M.S. 2005-09-21T22:20:03Z 2005-09-21T22:20:03Z 1990 1990 Thesis http://hdl.handle.net/1721.1/13434 25615925 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 135 leaves 8102906 bytes 8102667 bytes application/pdf application/pdf application/pdf Massachusetts Institute of Technology |
| spellingShingle | Electrical Engineering and Computer Science Ng, Kay-Yip A liquid-shear-stress sensor using wafer-bonding technology |
| title | A liquid-shear-stress sensor using wafer-bonding technology |
| title_full | A liquid-shear-stress sensor using wafer-bonding technology |
| title_fullStr | A liquid-shear-stress sensor using wafer-bonding technology |
| title_full_unstemmed | A liquid-shear-stress sensor using wafer-bonding technology |
| title_short | A liquid-shear-stress sensor using wafer-bonding technology |
| title_sort | liquid shear stress sensor using wafer bonding technology |
| topic | Electrical Engineering and Computer Science |
| url | http://hdl.handle.net/1721.1/13434 |
| work_keys_str_mv | AT ngkayyip aliquidshearstresssensorusingwaferbondingtechnology AT ngkayyip liquidshearstresssensorusingwaferbondingtechnology |