A liquid-shear-stress sensor using wafer-bonding technology

A liquid-shear-stress sensor using wafer-bonding technology

Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1990.

Bibliographic Details
Main Author:	Ng, Kay-Yip
Other Authors:	Martin A. Schmidt.
Format:	Thesis
Language:	eng
Published:	Massachusetts Institute of Technology 2005
Subjects:	Electrical Engineering and Computer Science
Online Access:	http://hdl.handle.net/1721.1/13434

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