Ultrahigh Superelastic Damping at the nano-scale: a robust phenomenon to improve smart MEMS devices

Ultrahigh Superelastic Damping at the nano-scale: a robust phenomenon to improve smart MEMS devices

© 2018 Acta Materialia Inc. Micro and nano pillars of Copper-based shape memory alloys (SMAs) with feature sizes between about 2 μm and 250 nm are known to exhibit ultra-high mechanical damping due to the nucleation and motion of stress-induced martensite interfaces during superelastic straining. Wh...

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Bibliographic Details
Main Authors: Gómez-Cortés, Jose F, Nó, María L, Ruíz-Larrea, Isabel, Breczewski, Tomasz, López-Echarri, Angel, Schuh, Christopher A, San Juan, Jose M
Other Authors: Massachusetts Institute of Technology. Department of Materials Science and Engineering
Format: Article
Language:English
Published: Elsevier BV 2021
Online Access:https://hdl.handle.net/1721.1/135896

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https://hdl.handle.net/1721.1/135896

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