Two-Phase Vapor Chambers with Micropillar Evaporators: A New Approach to Remove Heat from Future High-Performance Chips

Two-Phase Vapor Chambers with Micropillar Evaporators: A New Approach to Remove Heat from Future High-Performance Chips

© 2019 IEEE High power densities lead to thermal hot spots in modern processors. These power densities are expected to reach kW/cm2 scale in future high-performance chips and this increase may significantly degrade performance and reliability, if not handled efficiently. Using two-phase vapor chambe...

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Bibliographic Details
Main Authors: Yuan, Zihao, Vaartstra, Geoffrey, Shukla, Prachi, Said, Mostafa, Reda, Sherief, Wang, Evelyn, Coskun, Ayse K.
Other Authors: Massachusetts Institute of Technology. Department of Mechanical Engineering
Format: Article
Language:English
Published: IEEE 2021
Online Access:https://hdl.handle.net/1721.1/137890

Internet

https://hdl.handle.net/1721.1/137890

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