Predicting the Thermal Behavior in Functional Textile Fibers Having Embedded Electronics

<jats:title>Abstract</jats:title><jats:p>In this paper, both steady-state and transient thermal simulations were performed on functional fibers having an embedded electronic chip acting as a heat source. Simulations were conducted for a range of different fiber materials and arbitr...

Full description

Bibliographic Details
Main Authors: Berry, Shaun, Redmond, Shawn, Wang, Tairan, Rothschild, Mordechai
Other Authors: Lincoln Laboratory
Format: Article
Published: Springer Science and Business Media LLC 2022
Subjects:
Online Access:https://hdl.handle.net/1721.1/145972