Predicting the Thermal Behavior in Functional Textile Fibers Having Embedded Electronics
<jats:title>Abstract</jats:title><jats:p>In this paper, both steady-state and transient thermal simulations were performed on functional fibers having an embedded electronic chip acting as a heat source. Simulations were conducted for a range of different fiber materials and arbitr...
Main Authors: | Berry, Shaun, Redmond, Shawn, Wang, Tairan, Rothschild, Mordechai |
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Other Authors: | Lincoln Laboratory |
Format: | Article |
Published: |
Springer Science and Business Media LLC
2022
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Subjects: | |
Online Access: | https://hdl.handle.net/1721.1/145972 |
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