Mitigation of Thermal Stability Concerns in FinFET Devices
Here, we developed a procedure for mitigating thermal hazards in packaged FinFET devices. A monitoring system was installed into devices, based on self-heating impact analysis in the system and device levels, to allow for the observation and alerting of chip temperature and reliability risks. A nove...
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| Format: | Article |
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Multidisciplinary Digital Publishing Institute
2022
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| Online Access: | https://hdl.handle.net/1721.1/145998 |