Mitigation of Thermal Stability Concerns in FinFET Devices
Here, we developed a procedure for mitigating thermal hazards in packaged FinFET devices. A monitoring system was installed into devices, based on self-heating impact analysis in the system and device levels, to allow for the observation and alerting of chip temperature and reliability risks. A nove...
| Main Authors: | , , |
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| Other Authors: | |
| Format: | Article |
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Multidisciplinary Digital Publishing Institute
2022
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| Online Access: | https://hdl.handle.net/1721.1/145998 |
| _version_ | 1811080226784935936 |
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| author | Bender, Emmanuel Bernstein, Joseph B. Boning, Duane S. |
| author2 | Massachusetts Institute of Technology. Microsystems Technology Laboratories |
| author_facet | Massachusetts Institute of Technology. Microsystems Technology Laboratories Bender, Emmanuel Bernstein, Joseph B. Boning, Duane S. |
| author_sort | Bender, Emmanuel |
| collection | MIT |
| description | Here, we developed a procedure for mitigating thermal hazards in packaged FinFET devices. A monitoring system was installed into devices, based on self-heating impact analysis in the system and device levels, to allow for the observation and alerting of chip temperature and reliability risks. A novel algorithm for reducing measurement noise by means of temperature fluctuation compensation and the filtering of invalid data is presented and demonstrated on packaged devices. The results presented in this work show that the proposed techniques make exceptional improvements to sensory accuracy. Using this methodology enables the mitigation of thermal concerns in systems, including large data servers, and accelerates development of smart resource allocation formations. |
| first_indexed | 2024-09-23T11:27:50Z |
| format | Article |
| id | mit-1721.1/145998 |
| institution | Massachusetts Institute of Technology |
| last_indexed | 2024-09-23T11:27:50Z |
| publishDate | 2022 |
| publisher | Multidisciplinary Digital Publishing Institute |
| record_format | dspace |
| spelling | mit-1721.1/1459982023-02-15T21:28:06Z Mitigation of Thermal Stability Concerns in FinFET Devices Bender, Emmanuel Bernstein, Joseph B. Boning, Duane S. Massachusetts Institute of Technology. Microsystems Technology Laboratories Here, we developed a procedure for mitigating thermal hazards in packaged FinFET devices. A monitoring system was installed into devices, based on self-heating impact analysis in the system and device levels, to allow for the observation and alerting of chip temperature and reliability risks. A novel algorithm for reducing measurement noise by means of temperature fluctuation compensation and the filtering of invalid data is presented and demonstrated on packaged devices. The results presented in this work show that the proposed techniques make exceptional improvements to sensory accuracy. Using this methodology enables the mitigation of thermal concerns in systems, including large data servers, and accelerates development of smart resource allocation formations. 2022-10-26T17:41:41Z 2022-10-26T17:41:41Z 2022-10-14 2022-10-26T11:07:48Z Article http://purl.org/eprint/type/JournalArticle https://hdl.handle.net/1721.1/145998 Electronics 11 (20): 3305 (2022) PUBLISHER_CC http://dx.doi.org/10.3390/electronics11203305 Creative Commons Attribution https://creativecommons.org/licenses/by/4.0/ application/pdf Multidisciplinary Digital Publishing Institute Multidisciplinary Digital Publishing Institute |
| spellingShingle | Bender, Emmanuel Bernstein, Joseph B. Boning, Duane S. Mitigation of Thermal Stability Concerns in FinFET Devices |
| title | Mitigation of Thermal Stability Concerns in FinFET Devices |
| title_full | Mitigation of Thermal Stability Concerns in FinFET Devices |
| title_fullStr | Mitigation of Thermal Stability Concerns in FinFET Devices |
| title_full_unstemmed | Mitigation of Thermal Stability Concerns in FinFET Devices |
| title_short | Mitigation of Thermal Stability Concerns in FinFET Devices |
| title_sort | mitigation of thermal stability concerns in finfet devices |
| url | https://hdl.handle.net/1721.1/145998 |
| work_keys_str_mv | AT benderemmanuel mitigationofthermalstabilityconcernsinfinfetdevices AT bernsteinjosephb mitigationofthermalstabilityconcernsinfinfetdevices AT boningduanes mitigationofthermalstabilityconcernsinfinfetdevices |