Mitigation of Thermal Stability Concerns in FinFET Devices
Here, we developed a procedure for mitigating thermal hazards in packaged FinFET devices. A monitoring system was installed into devices, based on self-heating impact analysis in the system and device levels, to allow for the observation and alerting of chip temperature and reliability risks. A nove...
Main Authors: | Bender, Emmanuel, Bernstein, Joseph B., Boning, Duane S. |
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Other Authors: | Massachusetts Institute of Technology. Microsystems Technology Laboratories |
Format: | Article |
Published: |
Multidisciplinary Digital Publishing Institute
2022
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Online Access: | https://hdl.handle.net/1721.1/145998 |
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