Low temperature heterogeneous integration of germanium on silicon
Data communication relies on interconnects between circuit elements on a chip as well as between chips. As feature sizes decrease for silicon (Si) complementary metal oxide semiconductor (CMOS) transistors, electrical interconnects face increasing delay and increasing power consumption. Photonic int...
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Massachusetts Institute of Technology
2023
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| Online Access: | https://hdl.handle.net/1721.1/147290 |