A Silicate-Based Packaging Material for 3-D Heterogeneous Integration of Microsystems
3D heterogeneous integration (HI) and wafer-level packaging (WLP) represent the cutting edge of microelectronics design and fabrication. However, the current limitations of microelectronics packaging materials inhibit the widespread implementation of these processes, which presents an opportunity to...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Thesis |
| Published: |
Massachusetts Institute of Technology
2023
|
| Online Access: | https://hdl.handle.net/1721.1/150254 https://orcid.org/0000-0003-4174-3399 |