Deep Transfer Learning for Macroscale Defect Detection in Semiconductor Manufacturing

This thesis proposes improvements to wafer macro inspection processes and tools on four axes at Texas Instruments. The major axis of improvement involves real-time machine learning recommendations regarding the presence of macroscale defects. In this work, a model for detecting central defects is de...

Szczegółowa specyfikacja

Opis bibliograficzny
1. autor: Waterworth, John Timothy
Kolejni autorzy: Boning, Duane
Format: Praca dyplomowa
Wydane: Massachusetts Institute of Technology 2023
Dostęp online:https://hdl.handle.net/1721.1/152881