Deep Transfer Learning for Macroscale Defect Detection in Semiconductor Manufacturing

This thesis proposes improvements to wafer macro inspection processes and tools on four axes at Texas Instruments. The major axis of improvement involves real-time machine learning recommendations regarding the presence of macroscale defects. In this work, a model for detecting central defects is de...

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Bibliographic Details
Main Author: Waterworth, John Timothy
Other Authors: Boning, Duane
Format: Thesis
Published: Massachusetts Institute of Technology 2023
Online Access:https://hdl.handle.net/1721.1/152881