Modern Trends in Microelectronics Packaging Reliability Testing

Modern Trends in Microelectronics Packaging Reliability Testing

In this review, recent trends in microelectronics packaging reliability are summarized. We review the technology from early packaging concepts, including wire bond and BGA, to advanced techniques used in HI schemes such as 3D stacking, interposers, fan-out packaging, and more recently developed sili...

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Bibliographic Details
Main Authors: Bender, Emmanuel, Bernstein, Joseph B., Boning, Duane S.
Other Authors: Massachusetts Institute of Technology. Microsystems Technology Laboratories
Format: Article
Published: MDPI AG 2024
Subjects:
Electrical and Electronic Engineering
Mechanical Engineering
Control and Systems Engineering
Online Access:https://hdl.handle.net/1721.1/153951

Internet

https://hdl.handle.net/1721.1/153951

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