Modern Trends in Microelectronics Packaging Reliability Testing
In this review, recent trends in microelectronics packaging reliability are summarized. We review the technology from early packaging concepts, including wire bond and BGA, to advanced techniques used in HI schemes such as 3D stacking, interposers, fan-out packaging, and more recently developed sili...
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| Format: | Article |
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MDPI AG
2024
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| Online Access: | https://hdl.handle.net/1721.1/153951 |
| _version_ | 1811078197855387648 |
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| author | Bender, Emmanuel Bernstein, Joseph B. Boning, Duane S. |
| author_facet | Bender, Emmanuel Bernstein, Joseph B. Boning, Duane S. |
| author_sort | Bender, Emmanuel |
| collection | MIT |
| description | In this review, recent trends in microelectronics packaging reliability are summarized. We review the technology from early packaging concepts, including wire bond and BGA, to advanced techniques used in HI schemes such as 3D stacking, interposers, fan-out packaging, and more recently developed silicon interconnect fabric integration. This review includes approaches for both design modification studies and packaged device validation. Methods are explored for compatibility in new complex packaging assemblies. Suggestions are proposed for optimizations of the testing practices to account for the challenges anticipated in upcoming HI packaging schemes. |
| first_indexed | 2024-09-23T10:55:28Z |
| format | Article |
| id | mit-1721.1/153951 |
| institution | Massachusetts Institute of Technology |
| last_indexed | 2024-09-23T10:55:28Z |
| publishDate | 2024 |
| publisher | MDPI AG |
| record_format | dspace |
| spelling | mit-1721.1/1539512024-04-19T05:38:29Z Modern Trends in Microelectronics Packaging Reliability Testing Bender, Emmanuel Bernstein, Joseph B. Boning, Duane S. Electrical and Electronic Engineering Mechanical Engineering Control and Systems Engineering In this review, recent trends in microelectronics packaging reliability are summarized. We review the technology from early packaging concepts, including wire bond and BGA, to advanced techniques used in HI schemes such as 3D stacking, interposers, fan-out packaging, and more recently developed silicon interconnect fabric integration. This review includes approaches for both design modification studies and packaged device validation. Methods are explored for compatibility in new complex packaging assemblies. Suggestions are proposed for optimizations of the testing practices to account for the challenges anticipated in upcoming HI packaging schemes. 2024-03-27T16:03:04Z 2024-03-27T16:03:04Z 2024-03-15 2024-03-27T13:15:46Z Article http://purl.org/eprint/type/JournalArticle 2072-666X https://hdl.handle.net/1721.1/153951 Micromachines 15 (3): 398 (2024) PUBLISHER_CC 10.3390/mi15030398 Micromachines Creative Commons Attribution https://creativecommons.org/licenses/by/4.0/ application/pdf MDPI AG Multidisciplinary Digital Publishing Institute |
| spellingShingle | Electrical and Electronic Engineering Mechanical Engineering Control and Systems Engineering Bender, Emmanuel Bernstein, Joseph B. Boning, Duane S. Modern Trends in Microelectronics Packaging Reliability Testing |
| title | Modern Trends in Microelectronics Packaging Reliability Testing |
| title_full | Modern Trends in Microelectronics Packaging Reliability Testing |
| title_fullStr | Modern Trends in Microelectronics Packaging Reliability Testing |
| title_full_unstemmed | Modern Trends in Microelectronics Packaging Reliability Testing |
| title_short | Modern Trends in Microelectronics Packaging Reliability Testing |
| title_sort | modern trends in microelectronics packaging reliability testing |
| topic | Electrical and Electronic Engineering Mechanical Engineering Control and Systems Engineering |
| url | https://hdl.handle.net/1721.1/153951 |
| work_keys_str_mv | AT benderemmanuel moderntrendsinmicroelectronicspackagingreliabilitytesting AT bernsteinjosephb moderntrendsinmicroelectronicspackagingreliabilitytesting AT boningduanes moderntrendsinmicroelectronicspackagingreliabilitytesting |