A unified approach and descriptor for the thermal expansion of two-dimensional transition metal dichalcogenide monolayers
Two-dimensional (2D) materials have enabled promising applications in modern miniaturized devices. However, device operation may lead to substantial temperature rise and thermal stress, resulting in device failure. To address such thermal challenges, the thermal expansion coefficient (TEC) needs to...
| Main Authors: | , , , , , , , |
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| 其他作者: | |
| 格式: | 文件 |
| 语言: | English |
| 出版: |
American Association for the Advancement of Science (AAAS)
2024
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| 在线阅读: | https://hdl.handle.net/1721.1/154949 |