The electromigration drift velocity and the reliability of dual-damascene copper interconnect trees

The electromigration drift velocity and the reliability of dual-damascene copper interconnect trees

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2004.

Bibliografiset tiedot
Päätekijä: Wei, Frank L. (Frank Lili), 1977-
Muut tekijät: Carl V. Thompson.
Aineistotyyppi: Opinnäyte
Kieli:eng
Julkaistu: Massachusetts Institute of Technology 2006
Aiheet:
Materials Science and Engineering.
Linkit:http://hdl.handle.net/1721.1/30124

Internet

http://hdl.handle.net/1721.1/30124

Samankaltaisia teoksia