The electromigration drift velocity and the reliability of dual-damascene copper interconnect trees

The electromigration drift velocity and the reliability of dual-damascene copper interconnect trees

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2004.

Bibliographic Details
Main Author: Wei, Frank L. (Frank Lili), 1977-
Other Authors: Carl V. Thompson.
Format: Thesis
Language:eng
Published: Massachusetts Institute of Technology 2006
Subjects:
Materials Science and Engineering.
Online Access:http://hdl.handle.net/1721.1/30124

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