Droplet Bouncing Behavior in the Direct Solder Bumping Process
This paper presents the results of an ongoing effort to develop a direct solder bumping process for electronics packaging. The proposed process entails delivering molten droplets onto specific locations on electronic devices to form solder bumps. This study is focused on investigating droplet deposi...
| Glavni autori: | , |
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| Format: | Članak |
| Jezik: | en_US |
| Izdano: |
2003
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| Teme: | |
| Online pristup: | http://hdl.handle.net/1721.1/3738 |