Droplet Bouncing Behavior in the Direct Solder Bumping Process

This paper presents the results of an ongoing effort to develop a direct solder bumping process for electronics packaging. The proposed process entails delivering molten droplets onto specific locations on electronic devices to form solder bumps. This study is focused on investigating droplet deposi...

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Bibliografski detalji
Glavni autori: Hsiao, Wayne, Chun, Jung-Hoon
Format: Članak
Jezik:en_US
Izdano: 2003
Teme:
Online pristup:http://hdl.handle.net/1721.1/3738