Three dimensional integration technology using copper wafer bonding

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2006.

Bibliographic Details
Main Author:	Fan, Andy, 1976-
Other Authors:	L. Rafael Reif and Akintunde Ibitayo Akinwande.
Format:	Thesis
Language:	eng
Published:	Massachusetts Institute of Technology 2008
Subjects:	Electrical Engineering and Computer Science.
Online Access:	http://dspace.mit.edu/handle/1721.1/37915 http://hdl.handle.net/1721.1/37915

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