Review of Direct Metal Bonding for Microelectronic Interconnections
Microelectronic interconnections require advanced joining techniques. Direct metal bonding methods, which include thercomsonic and thermocompression bonding, offer remarkable advantages over soldering and adhesives joining. These processes are reviewed in this paper. The progress made in this area i...
| Main Authors: | , |
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| Format: | Article |
| Language: | en_US |
| Published: |
2003
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| Subjects: | |
| Online Access: | http://hdl.handle.net/1721.1/3840 |