Review of Direct Metal Bonding for Microelectronic Interconnections
Microelectronic interconnections require advanced joining techniques. Direct metal bonding methods, which include thercomsonic and thermocompression bonding, offer remarkable advantages over soldering and adhesives joining. These processes are reviewed in this paper. The progress made in this area i...
| Main Authors: | , |
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| Format: | Article |
| Language: | en_US |
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2003
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| Subjects: | |
| Online Access: | http://hdl.handle.net/1721.1/3840 |
| _version_ | 1826202440912863232 |
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| author | Zhang, G.G. Wong, Chee Cheong |
| author_facet | Zhang, G.G. Wong, Chee Cheong |
| author_sort | Zhang, G.G. |
| collection | MIT |
| description | Microelectronic interconnections require advanced joining techniques. Direct metal bonding methods, which include thercomsonic and thermocompression bonding, offer remarkable advantages over soldering and adhesives joining. These processes are reviewed in this paper. The progress made in this area is outlined. Some work concerned with the bonding modeling is also presented. This model is based on the joint interface mechanics resulting from compression. Both bump and substrate deformation are taken into account. The improved understanding of the relationship between the deformation and bonding formation may provide more accurate joint evaluation criterion. |
| first_indexed | 2024-09-23T12:07:30Z |
| format | Article |
| id | mit-1721.1/3840 |
| institution | Massachusetts Institute of Technology |
| language | en_US |
| last_indexed | 2024-09-23T12:07:30Z |
| publishDate | 2003 |
| record_format | dspace |
| spelling | mit-1721.1/38402019-04-12T07:40:26Z Review of Direct Metal Bonding for Microelectronic Interconnections Zhang, G.G. Wong, Chee Cheong direct metal bonding microelectronic interconnections bump deformation substrate deformation thermosonic bonding compression modeling thermocompression bonding Microelectronic interconnections require advanced joining techniques. Direct metal bonding methods, which include thercomsonic and thermocompression bonding, offer remarkable advantages over soldering and adhesives joining. These processes are reviewed in this paper. The progress made in this area is outlined. Some work concerned with the bonding modeling is also presented. This model is based on the joint interface mechanics resulting from compression. Both bump and substrate deformation are taken into account. The improved understanding of the relationship between the deformation and bonding formation may provide more accurate joint evaluation criterion. Singapore-MIT Alliance (SMA) 2003-12-13T17:46:30Z 2003-12-13T17:46:30Z 2004-01 Article http://hdl.handle.net/1721.1/3840 en_US Advanced Materials for Micro- and Nano-Systems (AMMNS); 343178 bytes application/pdf application/pdf |
| spellingShingle | direct metal bonding microelectronic interconnections bump deformation substrate deformation thermosonic bonding compression modeling thermocompression bonding Zhang, G.G. Wong, Chee Cheong Review of Direct Metal Bonding for Microelectronic Interconnections |
| title | Review of Direct Metal Bonding for Microelectronic Interconnections |
| title_full | Review of Direct Metal Bonding for Microelectronic Interconnections |
| title_fullStr | Review of Direct Metal Bonding for Microelectronic Interconnections |
| title_full_unstemmed | Review of Direct Metal Bonding for Microelectronic Interconnections |
| title_short | Review of Direct Metal Bonding for Microelectronic Interconnections |
| title_sort | review of direct metal bonding for microelectronic interconnections |
| topic | direct metal bonding microelectronic interconnections bump deformation substrate deformation thermosonic bonding compression modeling thermocompression bonding |
| url | http://hdl.handle.net/1721.1/3840 |
| work_keys_str_mv | AT zhanggg reviewofdirectmetalbondingformicroelectronicinterconnections AT wongcheecheong reviewofdirectmetalbondingformicroelectronicinterconnections |