Through-substrate interconnects for 3-D integration and RF systems

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, February 2007.

Bibliographic Details
Main Author:	Wu, Joyce H. (Joyce Hsia-Sing), 1974-
Other Authors:	Jesús A. del Alamo.
Format:	Thesis
Language:	eng
Published:	Massachusetts Institute of Technology 2007
Subjects:	Electrical Engineering and Computer Science.
Online Access:	http://hdl.handle.net/1721.1/38922

Internet

http://hdl.handle.net/1721.1/38922