Reliability of copper interconnects in integrated circuits

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2007.

Bibliographic Details
Main Author:	Choi, Zung-Sun
Other Authors:	Carl V. Thompson.
Format:	Thesis
Language:	eng
Published:	Massachusetts Institute of Technology 2008
Subjects:	Materials Science and Engineering.
Online Access:	http://dspace.mit.edu/handle/1721.1/39553 http://hdl.handle.net/1721.1/39553

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