Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds Using Nanoindentation

Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds Using Nanoindentation

With increasing miniaturization in microelectronics the wirebonds used in IC packages are witnessing a thrust towards fine pitch wirebonding. To have a precise control over loop height of the wirebond for fine pitch wirebonding, it is imperative to do mechanical characterization of the wirebond. The...

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Bibliographic Details
Main Authors: Shah, M., Zeng, K., Tay, A.A.O., Suresh, Subra
Format: Article
Language:en_US
Published: 2003
Subjects:
nanoindentation
wirebonding
heat-affected zone (HAZ)
fine-pitch
recrystallization
DSC
hardness
SIMS
ball bond
gold wire
Online Access:http://hdl.handle.net/1721.1/3979

Internet

http://hdl.handle.net/1721.1/3979

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