Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds Using Nanoindentation
With increasing miniaturization in microelectronics the wirebonds used in IC packages are witnessing a thrust towards fine pitch wirebonding. To have a precise control over loop height of the wirebond for fine pitch wirebonding, it is imperative to do mechanical characterization of the wirebond. The...
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | en_US |
| Published: |
2003
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/1721.1/3979 |