Identification of Convection Constants for Electronic Packages Using Modified Genetic Algorithm and Reduced-Basis Method

Identification of Convection Constants for Electronic Packages Using Modified Genetic Algorithm and Reduced-Basis Method

A new inverse analysis method is presented to identify parameters of heat convection in microelectronic packages. This approach adopts a modified Micro Genetic Algorithm (µGA) in finding the global optimum of parameters. A reduced-basis approach is introduced in the forward heat transfer analysis so...

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Bibliographic Details
Main Authors: Yang, Zhenglin, Lee, Jung Hong, Liu, Guirong, Patera, Anthony T., Lam, Khin Yong
Format: Article
Language:en_US
Published: 2003
Subjects:
inverse analysis
microelectronic package
modified µGA
parameter identification
reduced-basis method
Online Access:http://hdl.handle.net/1721.1/4004

Internet

http://hdl.handle.net/1721.1/4004

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