Thermomechanical strain analysis of electronic packages using Moiré interferometry by computational and manual fringe reduction

Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1996.

Bibliographic Details
Main Author:	Slade, J. Morgan
Other Authors:	David K. Roylance.
Format:	Thesis
Language:	eng
Published:	Massachusetts Institute of Technology 2008
Subjects:	Materials Science and Engineering
Online Access:	http://hdl.handle.net/1721.1/40221

Internet

http://hdl.handle.net/1721.1/40221