Thermomechanical strain analysis of electronic packages using Moiré interferometry by computational and manual fringe reduction
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1996.
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| Other Authors: | |
| Format: | Thesis |
| Language: | eng |
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Massachusetts Institute of Technology
2008
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| Online Access: | http://hdl.handle.net/1721.1/40221 |
| _version_ | 1826195332307877888 |
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| author | Slade, J. Morgan |
| author2 | David K. Roylance. |
| author_facet | David K. Roylance. Slade, J. Morgan |
| author_sort | Slade, J. Morgan |
| collection | MIT |
| description | Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1996. |
| first_indexed | 2024-09-23T10:11:20Z |
| format | Thesis |
| id | mit-1721.1/40221 |
| institution | Massachusetts Institute of Technology |
| language | eng |
| last_indexed | 2024-09-23T10:11:20Z |
| publishDate | 2008 |
| publisher | Massachusetts Institute of Technology |
| record_format | dspace |
| spelling | mit-1721.1/402212019-04-10T13:58:34Z Thermomechanical strain analysis of electronic packages using Moiré interferometry by computational and manual fringe reduction Slade, J. Morgan David K. Roylance. Massachusetts Institute of Technology. Dept. of Materials Science and Engineering Materials Science and Engineering Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1996. Includes bibliographical references (leaves 123-125). by J. Morgan Slade. M.S. 2008-02-04T21:05:43Z 2008-02-04T21:05:43Z 1996 1996 Thesis http://hdl.handle.net/1721.1/40221 35953996 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 125 leaves application/pdf Massachusetts Institute of Technology |
| spellingShingle | Materials Science and Engineering Slade, J. Morgan Thermomechanical strain analysis of electronic packages using Moiré interferometry by computational and manual fringe reduction |
| title | Thermomechanical strain analysis of electronic packages using Moiré interferometry by computational and manual fringe reduction |
| title_full | Thermomechanical strain analysis of electronic packages using Moiré interferometry by computational and manual fringe reduction |
| title_fullStr | Thermomechanical strain analysis of electronic packages using Moiré interferometry by computational and manual fringe reduction |
| title_full_unstemmed | Thermomechanical strain analysis of electronic packages using Moiré interferometry by computational and manual fringe reduction |
| title_short | Thermomechanical strain analysis of electronic packages using Moiré interferometry by computational and manual fringe reduction |
| title_sort | thermomechanical strain analysis of electronic packages using moire interferometry by computational and manual fringe reduction |
| topic | Materials Science and Engineering |
| url | http://hdl.handle.net/1721.1/40221 |
| work_keys_str_mv | AT sladejmorgan thermomechanicalstrainanalysisofelectronicpackagesusingmoireinterferometrybycomputationalandmanualfringereduction |