Commercialization of low temperature copper thermocompression bonding for 3D integrated circuits

Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2008.

Bibliographic Details
Main Author:	Nagarajan, Raghavan
Other Authors:	Carl V. Thompson II and Chee Lip Gan.
Format:	Thesis
Language:	eng
Published:	Massachusetts Institute of Technology 2009
Subjects:	Materials Science and Engineering.
Online Access:	http://hdl.handle.net/1721.1/45389

Internet

http://hdl.handle.net/1721.1/45389