Kinetics modeling and 3-dimensional simulation of surface roughness during plasma etching

Kinetics modeling and 3-dimensional simulation of surface roughness during plasma etching

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Chemical Engineering, 2009.

Bibliographic Details
Main Author: Guo, Wei, Ph. D. Massachusetts Institute of Technology
Other Authors: Herbert H. Swain.
Format: Thesis
Language:eng
Published: Massachusetts Institute of Technology 2009
Subjects:
Chemical Engineering.
Online Access:http://hdl.handle.net/1721.1/46600

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