Framework for characterization of copper interconnect in damascene CMP processes

Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science; and, Thesis (B.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1998.

Bibliographic Details
Main Author: Park, Tae Hong, 1973-
Other Authors: Duane Boning and James Chung.
Format: Thesis
Language:eng
Published: Massachusetts Institute of Technology 2009
Subjects:
Online Access:http://hdl.handle.net/1721.1/50041