Modeling of advanced integrated circuit planarization processes : electrochemical-mechanical planarization (eCMP), STI CMP using non-conventional slurries

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2009.

Bibliographic Details
Main Author:	Johnson, Joy Marie
Other Authors:	Duane S. Boning.
Format:	Thesis
Language:	eng
Published:	Massachusetts Institute of Technology 2010
Subjects:	Electrical Engineering and Computer Science.
Online Access:	http://hdl.handle.net/1721.1/52807

Internet

http://hdl.handle.net/1721.1/52807