Thermodynamic modeling of solder melting and solidification for proposed squishbot design

Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2009.

Bibliographic Details
Main Author:	Utz, Robert (Robert C.)
Other Authors:	Martin Culpepper.
Format:	Thesis
Language:	eng
Published:	Massachusetts Institute of Technology 2010
Subjects:	Mechanical Engineering.
Online Access:	http://hdl.handle.net/1721.1/54485

Internet

http://hdl.handle.net/1721.1/54485