Precision in-plane hand assembly of bulk microfabricated components for high-voltage MEMS arrays applications

Precision in-plane hand assembly of bulk microfabricated components for high-voltage MEMS arrays applications

This paper reports the design and experimental validation of an in-plane assembly method for centimeter-scale bulk-microfabricated components. The method uses mesoscaled deep-reactive-ion-etching (DRIE)-patterned cantilevers that deflect and lock into small v-shaped notches as a result of the hand-e...

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Bibliographic Details
Main Authors: Akinwande, Akintunde Ibitayo, Velasquez-Garcia, Luis Fernando, Gassend, Blaise
Other Authors: Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Format: Article
Language:en_US
Published: Institute of Electrical and Electronics Engineers 2010
Subjects:
high-voltage MEMS packaging
Electrospray
MEMS hand assembly
Online Access:http://hdl.handle.net/1721.1/59328
https://orcid.org/0000-0003-3001-9223

Internet

http://hdl.handle.net/1721.1/59328
https://orcid.org/0000-0003-3001-9223

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