Precision in-plane hand assembly of bulk microfabricated components for high-voltage MEMS arrays applications
This paper reports the design and experimental validation of an in-plane assembly method for centimeter-scale bulk-microfabricated components. The method uses mesoscaled deep-reactive-ion-etching (DRIE)-patterned cantilevers that deflect and lock into small v-shaped notches as a result of the hand-e...
| Main Authors: | , , |
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| Other Authors: | |
| Format: | Article |
| Language: | en_US |
| Published: |
Institute of Electrical and Electronics Engineers
2010
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| Subjects: | |
| Online Access: | http://hdl.handle.net/1721.1/59328 https://orcid.org/0000-0003-3001-9223 |