Effect of bonding and aging temperatures on bond strengths of Cu with 75Sn25In solders
In the present study, the interaction between thin film Cu and non-eutectic Sn-In is studied. The effects of the bonding and aging temperature on microstructure, IMC formation and also shear strength are investigated by SEM/EDX, XRD and shear testing. The bonding mechanism is proposed based on the o...
| Principais autores: | , , , , |
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| Outros Autores: | |
| Formato: | Artigo |
| Idioma: | en_US |
| Publicado em: |
Institute of Electrical and Electronics Engineers
2010
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| Acesso em linha: | http://hdl.handle.net/1721.1/60303 https://orcid.org/0000-0002-0121-8285 |